Alpha HiTech SMD Adhesives
is a fast-heat, curable surface mount adhesive formulated for high-speed dispensers and screen-printing applications. These products are designed to hold surface mount components during wave soldering.
Alpha HiTech Low-Temperature Adhesive
is designed for bonding temperature-sensitive devices to various plastic and metal surfaces where the materials cannot withstand high curing temperatures. The camera module market is an example of these adhesives’ applicability.
Alpha HiTech UV Adhesive
is formulated to be cured at ambient temperature under ultraviolet light. These products can be used in various applications, such as coating components requiring high tensile strength and moisture resistance.
Alpha HiTech Underfill
is an epoxy material to be dispensed on the edges of the BGA, CSP or Flip Chip devices. The material then flows beneath the component through capillary action. Upon completion of the curing process, the cured underfill helps strengthen the soldered assembled component, allowing it to pass reliability tests such as Drop Shock, Impact Bend, and Thermal Cycle.
Alpha HiTech Edgebond
is a one component, heat curable material for edge or corner bonding applications. Upon deposition, it will not flow beneath the BGA. The cured edge bond will help to strengthen the soldered assembled component, allowing it to pass reliability tests such as Drop Shock, Impact Bend, and Thermal Cycle.
Alpha HiTech Encapsulant
is a one component, intermediate temperature, fast heat curable material which is designed to mechanically protect assembled chips and encapsulated IC devices from dropping off or cracking. These encapsulants are formulated for applications in portable devices requiring extra reliability protection. The smartphone market is one example of where these encapsulants are very applicable.
For more information on Alpha HiTech bonding material products, please download the Alpha HiTech brochure and contact our sales!
