Alpha OM-362 is a lead-free, zero-halogen, no-clean solder paste in T4 powder. It is designed to provide ultra-low voiding performance on all components, including bottom-terminated components (BTC) and BGAs.
Alpha OM-362 achieves and exceeds IPC Class III voiding on BGA and Bottom Terminated Components, averaging below 10% voiding.
Alpha OM-362 can be combined with traditional SAC305 or high-reliability Innolot alloy to archive industry-leading solutions for high-reliability applications.
OM-362 can offer your products and assembly process:
- Ultra-Low Voiding Performance: Enables increased process stability and enhances the thermal and electrical performance of the most demanding component applications, such as BTCs and BGAs.
- Excellent Electromigration Characteristics: Passes J-STD-004C IPC-TM-650 at 200um to ensure reliability and functionality of fine-pitched components.
- Wide Reflow Profile Window: Enables high-quality solderability of complicated, high-density PCB assemblies using ramp or soak profiles, as high as 150C to 200C soak.
- Good Coalescence and Wetting Performance: Coalesces down to 180um, exhibiting good wetting characteristics and solder joint reliability.
- Excellent Solder Joint and Flux Residue Cosmetics: Easily penetrable and clear flux residues enable good probe contact during quality inspection.
- Zero-Halogen, No Halogens Intentionally Added: Ensures RoHS compliance for a safe and environmentally friendly assembly process.
For more information, please download OM-362 TDS and contact our sales.
