Gen3 Systems designs and manufactures world-renowned process and quality control testing systems for electronics manufacturing.
Gen3 Systems also cooperates closely with international organizations such as BSi, IEC, and IPC when developing new electronic reliability standards.
Gen3 Systems offers testing systems for several electronics reliability issues.
MUST 3 solderability testing system
The MUST 3 solderability testing system can verify the solderability of electronic components before they are used in the production process. The system can test components up to 0201 in size.
Components stored for a long time in factory warehouses may have poor solderability due to oxidation or contamination. The testing system can detect poor solderability even before production. This could bring significant cost savings when the solderability problem is detected before production.
The testing system can also be used to examine possible counterfeit components.
More information about the MUST 3 solderability testing system is on the Gen3 Systems website.
CM+ series purity testing system
The CM+ testing system combines the traditional ROSE and PICT testing methods. It can verify the reliability of electronic assembly washing processes.
The CM+ testing system, with its closed-loop testing principle, identifies even the smallest impurities and gives reliable test results from washed electronic assemblies.
More information about the CM+ series testing system on the Gen3 Systems website.
AutoSIR2+ Surface Insulation Resistance testing system
The Gen3 Systems AutoSIR2+ testing system can perform SIR reliability testing for electronic assemblies of several standards.
With the testing system, even the smallest electrochemical reactions in the assemblies can be detected, ensuring their functionality in challenging conditions.
More information about the AutoSIR2+ testing system on the Gen3 Systems website.
AutoCAF2+ Conductive Anodic Filament testing system
The AutoCAF2+ system can be used to test the circuit board’s internal electrochemical reactions. CAF, i.e., Conductive Anodic Filament, is a copper growth growing inside the circuit board between two conductors, which is accelerated by voltage differences and high humidity.
More information about the AutoCAF2+ testing system on the Gen3 Systems website.
You can get more information about all Gen3 Systems testing systems by contacting our sales or from the links above.
