Johtavat foamit

Kategoria EMC- ja RF-suojaus

Johtavat foamit sopivat erinomaisesti sovelluksiin, jotka edellyttävät EMI-suojauksen, johtavuuden alhaisilla puristusvoimilla ja tehokkuuden erittäin suurissa taajuuksissa. Foamit on valmistettu nikkeli/kupari tai hopea päällystetyistä polyesteri- tai nailonkankaista, jotka antavat sähkönjohtavuuden kuidun pinnalle. Johtavia foameja on saatavana asiakohtaisina malleina.

Ominaisuudet:

Pinnan resistanssi <0,08 Ohm / m2
Kompressio <15 %
10–1000 MHz: n suojausteho
-40–70 °C käyttölämpötila

Paksuudet:

0.45 mm
1.00 mm
1.5 mm
2.3 mm
3.4 mm
5.0 mm

SMT

For more than 20 years SMT is the designated specialist for thermal processes with more than 5000 sold units. Know-how easily could be purchased at SMT.

Progress, innovative technology that takes the preservation and protection of resources and the environment into consideration is the philosophy of SMT. Not without reason is SMT the manufacturer of the most energy-saving and easiest to maintain reflow soldering systems in Germany, systems where heat transfer is effected exclusively via a positively-driven convection system.

The portfolio consist from extremely small systems for laboratories and development, via medium-sized units and on down to large systems for the industrial production of electronic modules. Customer-related wishes are always taken into consideration and so flow into our company as part of the continuous improvement process.

Milestones:

Foundation of SMT company by Hans-Günter Ulzhöfer in 1987
First Reflow soldering systems based on IR-radiation technology
First full convection-reflow-soldering systems in 1994
Patent of the revolutionary “Slot Nozzle System” to optimize heat transmission in 1995
Patent of “Double Peak Method” for further optimation of heat transmission especially for difficult PCBs in 1997
Presentation of a new product generation with intention and target „lowest operation costs in power and nitrogen consumption“ and highest availability in 2000
Presentation of the technical unique „ABS process gas cleaning system“ in 2003
Market introduction of the intelligent nitrogen control and measurement system to stabilize the ppm-levels in different operating modes and reduction of operation costs in 2003
Totally new development of the „Power Nozzle Systems“ in 2004 as our answer to higher requirements related to heat transmission in the age of lead-free soldering processes.
In 2007 amendment of the established product range of reflow soldering systems for „frontend area“ by the product range of HTT systems for the „backend area“
April 2008 Opening of the American branch, SMT North America, Inc., in Glen Allen, Richmond, VA
Construction of plant 3 in 2008
Opening of the new technology centre in plant 4 in September 2008
August 2009 Incorporation of SMT-AP Pte. Ltd. in Singapore
SMT Wertheim has been awarded the 2010 VISION Award in the category of Soldering Equipment “Best New Product” for the SMT Vacuum Plus N2 system.
2010 SMT Wertheim has been awarded the Global Technology Award in the category “Soldering Equipment”

Tuotantomateriaalit

Tuotantolaitteet

Compliance test systems

RF-safety

RF- and EMC-chambers and equipment

Johtavat foamit

Ominaisuudet:

Paksuudet:

Tuotantomateriaalit

Tuotantolaitteet

Compliance test systems

RF-safety

RF- and EMC-chambers and equipment

Wolfgang Warmbier

Wavecontrol

Tira

Thermaltronics

Teseq

Speedprint

AWARD-WINNING SMT STENCIL PRINTING SPECIALISTS

SMT

Schwarzbeck Mess-Elektronik

Schlegel

Salli

PVA

MPB

Milmega

Mechanical Devices

Maturo

Maturo

www.maturo-gmbh.com

Maturo

L.A.B. Equipment

Kyzen

Kemtron

Instrument Plastics

IFI

HumiSeal

HS Technik

HIOS

Hala

EM Test

CTS

Comtest

CHT (ACC Silicones)

CHT (ACC Silicones)

ARC Technologies

Alpha